| AN EXPERIMENTAL STUDY ON THE MICROTENSILE BONDING STRENGTH OF DENTIN TREATED BY CARISOLVTM |
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| CarisolvTM에 의한 우식제거후 Microtensile Bonding Strength에 관한 연구 |
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백병주, 권병우, 김재곤, 전철완 |
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전북대학교 치과대학 소아치과학교실 및 구강생체과학연구소 |
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| Abstract |
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The purpose of this study was to compare the microtensile bonding strength of chemomechanically excavated dentin(CarisolvTM) to conventional caries removal(bur). The following adhesive systems were used; AB: All-Bond 2(3M, USA), PB: Prime & Bond 2.1(Dentsply, DE), AQ: AQ Bond(sun medical, Japan). 42 human molars with occlusal caries were assigned to 6 groups. Sequential caries removal was controlled with laser fluorescence. Each group was devided as follows; group A, B, C were CarisolvTM applied, group D,E,F were bur used. In group A and D, AB was used as a dentin adhesive. group B,E and group C,F was AQ and AQ was used each. The cavity was filled with composite resin(Z-100). The specimens were sectioned vertically into multiple serial 0.7 mm thick slabs. And then those slabs were sectioned into rectangular parts under 0.7 mm width. Finally 0.7-1.0 mm a right hexahedron shape stick become. Microtensile bonding test was carried out with testing apparatus at cross-head speed of 0.5mm/min-1 and fractured surfaces were observed with scanning electron microscope(JSM-6400, Jeol, Japan). The obtained results were summarized as follows ; 1. In the group of caries removal with CarisolvTM, micro-tensile bonding strength decreased to 75.8~80 percent of bur used group. 2. In the group of caries removal with CarisolvTM, decreased degree of micro-tensile bonding strength is not so different in 3 kinds of dentin adhesives(p<0.05). 3. In the group of caries removal with CarisolvTM, microtensile bonding strength of AB, PB, AQ was 32.6MPa(2.4), 30.1Mpa (1.8), 21.2Mpa(1.9). 4. In the group of caries removal with Bur and CarisolvTM, microtensile bonding strength of AQ was significantly lower than that of AB and PB(p<0.01). |
| Key Words:
Bonding strength, CarisolvTM, Microtensile |
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