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J Korean Acad Pediatr Dent. 2009;36(1): 62-70.
Kyu-ho Yang, Su-Kyung Heo, Nam-ki Choi, Seon-mi Kim
Department of Pediatric Dentistry, Chonnam National University School of Dentistry, Dental Research Institute and Second stage of BK21
Received: November 21, 2008;  Accepted: February 9, 2009.
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The objective of this study was to measure the leaching of filler (Si, Ba) from nanofiller-contained composites (Palfique Estelite sigma® (Tokuyama Dental Corp., Tokyo, Japan), Z-350® (3M ESPE, USA), Ceram X duo E3®, D3® (Dentsply, Konstanz, Germany)) under different conditions. The samples used for the study of leachable components were made by insertion of the material into a circular mold, 10 mm in diameter and 3.0 mm high. Each specimen was placed in a disposable polystyrene vial containing 5 mL of distilled water, artificial saliva or 0.1N NaOH and kept in an oven at 37℃. ; water and artificial saliva - 150 days, 0.1N NaOH - 15days. Inductively coupled plasma atomic emission spectroscopy (ICP-AES) was used to determine the amount of Si and Ba in the test solutions. 1. Filler leaching was significantly great in 0.1N NaOH among all samples(p<.0.001). 2. When samples were stored in the distilled water, Estelite showed the lowest amount of Si leaching. When samples were stored in the artificial saliva, Z-350 showed the lowest amount of Si leaching. 3. There were significant differences in filler leaching between 3 storage medias and composite resins(p<.0.001). 4. Si and Ba leaching occurred in greater proportion when samples were stored in the artificial saliva than distilled water. 5. There were significant interactions in monthly filler leaching between leaching in artificial saliva and in distilled water, as well as the interaction between storage medium and filler(p<.0001). These results indicate that a continuous filler leaching of nanofiller-contained composite resins was in storing aqueous solutions under over time.
Keywords: Composite resin | Nanofiller | 0.1N NaOH | Artificial saliva | Distilled water | Filler leaching
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