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J Korean Acad Pediatr Dent. 2008;35(1): 18-29.
Eung-Hag Kim, Jong-Soo Kim, Seung-Hoon Yoo
Department of Pediatric Dentistry, School of Dentistry, Dankook University
Corresponding Author: Jong-Soo Kim ,Tel: 041-550-1931, Email: jskim@dku.edu
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The purpose of this study was to compare the polymerization shrinkage of several filling methods using strain gauges. In this study, a light-emitting diode(LED) curing unit(Elipar Freeligh2, 3M EPSE, USA) and plasma arc lamp(PAL) curing unit(Flipo, LOKKI, France) were used for curing, Filtek Z350TM(3M EPSE, USA) composite resin was used for the cavity filling. Sixty permanent bicuspid teeth, that were extracted for orthodontic treatment, were studied. The cavities were prepared on the occlusal surface and were filled using the following methods : 1) bulk filling, 2) parallel filling, 3) oblique filling The strain was recorded on the buccal, lingual, mesial and distal surfaces and the strain values were computed into stress values. The shear bond strength of each filling method was tested using a Micro Universal Testing machine. The results can be summarized as follows: 1. In the strain changes, all LED and PAL curing groups showed an increase on the buccal surface and a slow decrease as time elapsed. 2. In the strain changes of the mesial and distal surfaces, the decreases and increases were shown repeatedly and reduced as time elapsed. 3. There were no significant statistical strain changes among filling methods in the LED or PAL curing groups. 4. There were significant statistical strain changes between the LED and PAL curing groups on the buccal surface(p<0.05). 5. From the shear bond strength results, in the LED curing group, filling method 3 showed lower surface stress than filling method 1 and 2(p<0.05). In the PAL curing group, there were no significant statistical strain changes between each filling method. 6. The surface stress of each group was lower than the shear bond strength.
Keywords: Strain gauge | Composite resin | Filling method | Polymerization shrinkage | Shear bond strength
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